CoolingThermal Co., Ltd. is pleased to share that our team attended the 3rd AI High-Performance Computing Liquid Cooling & Heat Dissipation Technology Innovation Summit, held in Shanghai in 2024.
The summit gathered leading engineers, manufacturers, and technology decision-makers from across the AI computing and liquid cooling ecosystem — covering high-power chip thermal management, liquid cooling system design, heat dissipation components, and advanced manufacturing. As AI infrastructure continues to scale globally, events like this have become a critical forum for the industry to align on technology direction and supply chain capability.
CoolingThermal took the opportunity to showcase our automation equipment for heat pipe and vapor chamber production — the core thermal components that underpin modern liquid cooling systems for AI servers, data centers, and high-power electronics. Our team engaged directly with potential clients and explored new partnership opportunities with manufacturers across the supply chain.
The conversations at the summit reinforced a trend we see clearly in our own business: as AI chip power densities rise and liquid cooling becomes the standard — not the exception — demand for precision thermal component manufacturing is accelerating rapidly. Manufacturers need production equipment that can keep pace.
That is exactly what CoolingThermal has been building since 2017.
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Written by
CoolingThermal Engineering TeamCoolingThermal is an automation equipment manufacturer based in Kunshan, China, specializing in heat pipe and vapor chamber production equipment since 2017. Our engineering team designs, builds, and commissions complete production lines covering forming, degassing, welding, testing, and assembly processes. The technical content on this blog is written by the same team that develops the equipment — based on real production experience, not secondary research.
