Which one is better, the FIN or the reflow soldering technology? As both are computer heat sinks, how much is the difference?

The FIN ,inserting heat pipes into the heat sink fins without any thermal conductive medium in between, relying solely on direct contact to transfer heat. Some users might say that a thermal paste is still needed between the CPU and the heat pipe, and that direct contact without a thermal medium would be ineffective. However, this is not the case. The FIN process and the reflow soldering process each have their own advantages and disadvantages.

The heat dissipation fins of the FIN process are not a simple flat surface. In the area in contact with the heat pipe, they extend downward. As a result, when the heat dissipation fins of the FIN process are stacked layer upon layer, they can completely cover the heat pipe, and the heat dissipation effect will not be much worse than that of the return soldering process radiator.

Reflow soldering involves welding the contact parts of the heat sink fins and heat pipes with conductive materials such as solder paste. Compared to the through-FIN process, the cost of reflow soldering increases significantly. Therefore, reflow soldering is often associated with high-end and expensive heat sinks. The heat sink fins of tower-type heat sinks that adopt the reflow soldering process are completely flat. In the area in contact with the heat pipe, there is no specific downward extension. Therefore, in terms of contact area, reflow soldering has no advantage. However, in terms of heat conduction efficiency, reflow soldering is often stronger than the through-FIN process, but this can vary depending on the welding materials used by the manufacturer. The through-FIN process has the advantage of a large contact area, while reflow soldering has the advantage of high heat conduction efficiency. Even well-made through-FIN heat sinks are not necessarily worse than reflow soldering. However, in terms of the stability of the heat sink fins, reflow soldering is stronger than through-FIN. Reflow soldering is welded, so the position of the heat sink fins is basically not likely to move. While through-FIN is directly connected, some poorly made heat sinks, if you remove the top cover of the heat sink, you can even peel off the heat sink fins layer by layer. Therefore, through-FIN heat sinks are most prone to movement after multiple disassemblies, thereby affecting the heat dissipation efficiency.

• Written by

  CoolingThermal Engineering Team

  CoolingThermal is an automation equipment manufacturer based in Kunshan, China, specializing in heat pipe and vapor chamber production equipment since 2017. Our engineering team designs, builds, and commissions complete production lines covering forming, degassing, welding, testing, and assembly processes. The technical content on this blog is written by the same team that develops the equipment — based on real production experience, not secondary research.